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Espec Technologies


4.2 ( 8032 ratings )
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개발자: Spinn Labs Private Limited
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Espec Technologies Pte Ltd has more than 20 years in the PCB industry, providing a one-stop solution from PCB design, PCB and PCBA for both commercial and BIB boards. We supply a wide array of products including Rigid , Rigid Flex, Flex, Metal PCB, Substrate, BIB,MCC, Probe card and Load board. We are also ISO9002, ISO14001, TS16949& UL certified.
Our Production Capabilities:
Up to 66 layer
High aspect ratio of 36
Fine pitch eg. 0.35mm
High copper thickness of 10 oz
Exotic material : Roger; Polymide ; Nelco

Our SMT Capabilities
PCB Max. Size: 300mm(L)×250mm(W)×4.0mm(T)
PCB Min. Size: 50mm(L) ×50mm(W)×0.3mm(T)
Component Min. Size: 01005(0.4mm×0.2mm)
IC Min. Space: 0.2mm
BGA Ball Space: Min. 0.25mm, Max.1.50mm
BGA Ball Dia.: Min. 0.10mm, Max.0.63mm
Min. space between component: 0.1mm
Capacity/Day: 5.5KK/Chip
BGA, Micro BGA, SOIC, PLCC and QFP types of packaged assemblies.
Support SMT/CSP/COB and Assembly process